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Scanning Electron Microscopy (SEM) is a common imaging modality used in the semiconductor industry particularly for failure analysis [1, 2]. In addition, with the recent growing concern of physical attacks on electronics with malicious intent, SEMs are becoming more attractive for hardware assurance and especially, Reverse Engineering (RE)[4]. However, RE requires long hours of imaging for an IC even if it is done automatically. In [3], the estimated time to image an IC of size 1.5 mm x 1.5 mm employing a 130nm node technology with high resolution went up to 30 days. With the ongoing trend of adding more structures onto a limited space on the IC, the imaging time frame is becoming unfeasible. This drawback would be manageable in situations where there is a prior knowledge on the exact location to be imaged. However, in case of hardware assurance and reverse engineering, where all the structures in the …more » « less
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